Ceramic substrates for probe cards.
Ceramic small outline packages.
Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn.
Csop ceramic small outline packages mm inch unit.
Standard packages and lids for device evaluation.
Material properties process flow.
Ceramic small outline package csop national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.
Small outline package straight lead small outline l leaded package 1 27.
Up u down d 1st 2nd 3rd total pitch stand off height seal ring.
Also used as a structural material in ceramic.
Mm lead count cavity overall layer thickness lead ntk material code b black w white connection 0 non conect drawing no.
Ceramic packages for large scale integration lsi devices.
Copper cu a copper alloy a copper nickel tin alloy is used as the lead frame material in plastic packages.
Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.